EP2SGX30DF780C4 vs EP2SGX30DF780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780C4 sa pamamagitan ng Intel at EP2SGX30DF780C3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel
EP2SGX30DF780C4 ✗ Tapus ng Buhay
Pagsanggunian na paghahambing
| Parametro | EP2SGX30DF780C4 | EP2SGX30DF780C3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Tapus ng Buhay | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,880 | — |
| Number of LABs / CLBs | 1,694 | — |
| Total Number of I/Os | 361 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) | — |
| Programmable Terminals | BGA ball grid (780 terminals) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant (per manufacturer product page) | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 33,880 |
| Logic Cells / Blocks | — | 33,880 |
| Embedded Memory Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| LABs / CLBs | — | 1694 |
| Internal Frequency | — | 622 MHz |
| Number of Pins / Balls | — | 780 |
| Package Type | — | FC-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Temperature na Operasyon | — | -40 C to +85 C |
| Logic Family | — | CMOS |