EP2SGX30DF780C4 vs EP2SGX30DF780C7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780C4 sa pamamagitan ng Intel at EP2SGX30DF780C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX30DF780C4 EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel

EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel

EP2SGX30DF780C4 ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780C4 EP2SGX30DF780C7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Tapus ng Buhay Obsolete
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Cells 33,880 —
Number of LABs / CLBs 1,694 —
Total Number of I/Os 361 —
Maximum Operating Frequency 717 MHz —
Number of Transceivers 20 (embedded multi-gigabit) —
Core Voltage 1.2 V —
Packhaging FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) 780-Ball FBGA (DF780), 1.0 mm pitch
Uri ng Pagpapasok Surface Mount —
Process Technology 90 nm CMOS —
Operating Temperature Grade Commercial (C4) —
Programmable Terminals BGA ball grid (780 terminals) —
Package Code BGA —
Package Shape Square —
Level ng MSL [DATA_NEEDED: MSL level] —
Tindminan RoHS Compliant (per manufacturer product page) [DATA_NEEDED: RoHS status]
Lead-Free Yes —
Series — Stratix II GX
Logic Elements (LE) — 33,880
Embedded Memory (bits) — 1,369,728
Memory Blocks — 482 (M512/M4K/M-RAM)
DSP Blocks — 24
18x18 Multipliers — 192
Maximum User I/O — 361
Speed Grade — -7
Temperature na Operasyon — 0C to +85C (Commercial)
Process Node — 90 nm
Core Voltage (VCCINT) — 1.2 V (typ)
Configuration — PS / FPP / JTAG
Transceiver Data Rate — [DATA_NEEDED: SERDES data rate]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita