EP2SGX30F780C3N vs EP2SGX30CF780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30F780C3N sa pamamagitan ng Altera at EP2SGX30CF780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2SGX30F780C3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Altera
EP2SGX30F780C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX30F780C3N | EP2SGX30CF780C3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Total RAM Bits | 1,369,728 | — |
| User I/O Pins | 361 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Total Transceivers | Up to 12 | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | — |
| Max Internal Frequency | 816.9 MHz | — |
| Temperature na Operasyon | 0C to +85C (Commercial, C3 suffix) | 0C to +85C (commercial) |
| Package Type | 780-ball FC-FBGA (29x29 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AES-128 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Packhaging | — | 780-ball FineLine BGA |
| Process Node | — | 90 nm |
| Speed Grade | — | -3 |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Lead-Free | — | Yes |
| Wala sa Halogen | — | [DATA_NEEDED: halogen-free status] |