EP2SGX60CF780C5N vs EP2SGX60CF780C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60CF780C5N sa pamamagitan ng Intel at EP2SGX60CF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX60CF780C3N EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX60CF780C5N EP2SGX60CF780C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Series Stratix II GX Stratix II GX
Logic Elements 60,440 (60K LE) 60,440
Logic Array Blocks (LABs) 3022 [DATA_NEEDED: LAB count]
Total RAM Bits 2,544,192 (approximately 2.5 Mbit) —
User I/Os 364 —
High-Speed Transceiver Channels 20 (up to 6.375 Gbps per channel) —
Core Voltage 1.15 V to 1.25 V —
Internal Frequency (max) 717 MHz 816.9 MHz
Process Technology 90 nm CMOS 90 nm CMOS
Packhaging 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) —
Uri ng Pagpapasok Surface Mount —
Configuration Interface JTAG (IEEE 1149.1), passive/active serial —
Tindminan RoHS Compliant Lead-free / Compliant
Operating Temperature Grade Commercial (C) —
Transceiver Data Rate Up to 6.375 Gbps —
Device Type — FPGA (Field Programmable Gate Array)
User I/O Pins — 364
Embedded Memory (bits) — 2,544,192
Number of CLBs — 60,440
Core Supply Voltage — 1.2 V
Transceiver Channels — 12 (up to 6.375 Gbps)
Package Type — 780-ball FC-FBGA
Package Dimensions — 29 mm x 29 mm, 1.0 mm pitch
Level ng MSL — [DATA_NEEDED: MSL rating]

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