EP2SGX60DF780C3N vs EP2SGX60DF780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3N sa pamamagitan ng Intel at EP2SGX60DF780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX60DF780I4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C3N | EP2SGX60DF780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Tapus ng Buhay | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | — |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | — |
| Package Type | 780-pin FC-FBGA (DF780) | — |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | [DATA_NEEDED: propagation delay] |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range C] | -40C to +100C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (per distributor listing) | Compliant |
| Device Logic Elements | — | 60,440 |
| Logic Cells / CLBs | — | 60,440 |
| Total RAM Bits | — | 2,544,192 bits |
| User I/O Count | — | 364 |
| Transceivers | — | Embedded multi-gigabit transceivers (MGTs) |
| Transceiver Data Rate | — | [DATA_NEEDED: transceiver data rate in Gbps] |
| Internal Maximum Frequency | — | 732.1 MHz |
| Packhaging | — | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) |
| Speed Grade | — | I4 (Industrial, speed grade 4) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |