EP2SGX60DF780I4 vs EP2SGX60DF780I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780I4 sa pamamagitan ng Intel at EP2SGX60DF780I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX60DF780I4 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP2SGX60DF780I4 | EP2SGX60DF780I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix II GX | Stratix II GX |
| Device Logic Elements | 60,440 | — |
| Logic Cells / CLBs | 60,440 | — |
| Total RAM Bits | 2,544,192 bits | — |
| User I/O Count | 364 | — |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) | — |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate in Gbps] | — |
| Internal Maximum Frequency | 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) | FBGA-780 (DF) |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | I4 (Industrial, speed grade 4) | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant | — |
| Logic Elements | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| User I/O Pins | — | 364 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Package Body Size | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Lead Free | — | Yes |
| RoHS | — | Compliant |
| Maximum Internal Frequency | — | 732.1 MHz |