EP2SGX60EF1152C4K vs EP2SGX60EF1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152C4K sa pamamagitan ng Altera at EP2SGX60EF1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152C4K | EP2SGX60EF1152C3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Manufacturer | Intel / Altera | — |
| Series | Stratix II GX | Stratix II |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3022 | 3022 |
| Adaptive Logic Modules (ALMs) | 24,176 | 30,220 |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 |
| Embedded Memory (Kbits) | 3024 | — |
| Embedded 18x18 Multipliers | Up to 252 | — |
| User I/Os | 534 | — |
| Transceivers | Up to 12 (6.375 Gbps) | — |
| Maximum Fabric Frequency | 732.1 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (VCC) | 1.2 V | — |
| Speed Grade | C4 | C3 (commercial, -3 bin) |
| Temperature na Operasyon | 0C to 85C (Commercial) | 0C to +85C (commercial) |
| Packhaging | 1152-BBGA / FC-FBGA, Flip-Chip | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Configuration Mode | Enhanced Configuration (EPC) - K suffix | — |
| Family | — | Stratix II GX |
| Maximum User I/Os | — | 534 |
| Core Voltage (Vcc) | — | 1.2 V |
| Maximum Internal Frequency | — | 717 MHz |
| Propagation Delay | — | 0.40 ns |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| PLLs | — | 4 |
| Transceiver Data Rate | — | 3.125 Gbps per channel |