EP2SGX60EF1152I5N vs EP2SGX60EF1162I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152I5N sa pamamagitan ng Intel at EP2SGX60EF1162I4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152I5N | EP2SGX60EF1162I4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Unknown | NRND |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 60,440 | — |
| Logic Blocks | 60,440 | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Internal Frequency | 717 MHz | — |
| Reported Internal Frequency | 609.76 MHz | — |
| Maksimum na Taktiko ng Oras | 622.08 MHz | — |
| Hanay ng Temperature na Operasyon | -40 °C to 85 °C | — |
| Packhaging | 1152-ball BGA | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch |
| Package Type | FC-FBGA | — |
| Package Dimensions | 23 x 23 mm | — |
| Terminal Pitch | 1 mm | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and size] | — |
| I/O Count | [DATA_NEEDED: user I/O count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Tindminan RoHS | unknown | Compliant |
| REACH Status | unknown | — |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| Embedded Memory | — | 2,544,192 bits |
| DSP Blocks | — | 12 |
| 18x18 Multipliers | — | 252 |
| User I/Os | — | 534 |
| Transceivers | — | Up to 20 (600 Mbps to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Speed Grade | — | I4 (industrial) |
| Temperature Range | — | -40C to +100C (junction) |
| Core Voltage | — | 1.2 V |
| Configuration Mode | — | Enhanced (EPC) / Fast Passive Parallel (FPP) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 90 nm |