EP2SGX90FF1508C3 vs EP2SGX90FF1508C5ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C3 sa pamamagitan ng Intel at EP2SGX90FF1508C5ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 ObsoleteIntel
EP2SGX90FF1508C5ES - Stratix II GX 90K LE FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C5ES ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508C3 | EP2SGX90FF1508C5ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| LABs / CLBs | 4,548 | — |
| Total Memory Bits | 4,520,448 | — |
| Maximum User I/O | 650 | — |
| Number of Transceivers | 4 (per family datasheet) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | 0C to +85C (commercial) | Commercial Extended (0C to +85C) |
| Speed Grade | -3 | C5 |
| Process Technology | 90 nm CMOS | 90 nm |
| Package Type | 1508-ball FC-FBGA (FBGA-1508) | — |
| Package Dimensions | 40 x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (Tray) | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration Method | SRAM-based, JTAG / Passive / Active serial | — |
| Logic Elements (LEs) | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 45,960 |
| Embedded Memory Bits | — | 4,494,720 |
| Maximum User I/O Pins | — | 650 |
| Transceiver Channels | — | 12 (3.125 Gbps, upgradable to 6.375 Gbps) |
| Maximum Core Frequency | — | 609.76 MHz |
| Packhaging | — | 1508-ball FC-FBGA (FF1508) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |