EP3C16U256C8N vs EP3C5U256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16U256C8N sa pamamagitan ng Intel at EP3C5U256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
EP3C5U256C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3C16U256C8N | EP3C5U256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | — |
| Logic Elements | 15,408 | 5,136 |
| Total Memory Bits | 516,096 bits | — |
| Embedded Multipliers (18 x 18) | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O | 168 | — |
| Packhaging | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) | 256-UBGA (Ultra FineLine BGA) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 65 nm low-power | 60 nm low-power CMOS |
| Speed Grade | 8 (C8, commercial) | C6 |
| Temperature ng Junction na Operasyon | -40 °C to +85 °C | — |
| Configuration Modes | JTAG, AS, PS, FPP | AS, PS, JTAG, Fast Passive Parallel |
| Uri ng Pagpapasok | Surface Mount (BGA, requires microvia PCB) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant (Pb-free) | — |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead Free / RoHS | — | Yes / Compliant |