EP3C40F780C8N vs EP3C40F780C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780C8N sa pamamagitan ng Intel at EP3C40F780C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F780C8N | EP3C40F780C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone® III | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | — |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Temperature na Operasyon | 0°C to +85°C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 8 (C8) | 7 (C7, commercial) |
| Packhaging | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Process Technology | 65nm TSMC low-power | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | — |
| Logic Elements | — | 39,600 LE |
| Total RAM Bits | — | 1,161,216 bits |
| Embedded Multipliers | — | 126 (18x18) |
| User I/Os | — | 535 |
| Process Node | — | 65 nm TSMC low-power |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Moisture Sensitivity Level | — | MSL3 (per J-STD-020) |