EP3C40F780I7 vs EP3C40F780C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780I7 sa pamamagitan ng Intel at EP3C40F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C40F780I7 EP3C40F780C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone® III Cyclone III
Logic Elements (LEs) 39,600 —
Embedded Memory Bits 1,161,216 bits —
M9K Memory Blocks 234 —
MLAB Memory Bits 112,500 bits —
Embedded Multipliers (18x18) 126 —
9-bit Multiplier Elements 535 —
PLLs 4 —
Maximum User I/Os 535 535
Maximum Operating Frequency 472.5 MHz —
Process Technology 65 nm low-power CMOS 65nm TSMC low-power
Core Voltage (VCCINT) 1.2 V —
Packhaging 780-ball FineLine BGA (F780) 780-ball FBGA, 1.0mm pitch
Package Dimensions [DATA_NEEDED: package dimensions in mm] —
Temperature na Operasyon -40C to +100C (industrial, I7) 0°C to +85°C (Commercial)
Tindminan RoHS Compliant Compliant
Configuration Method JTAG / Active Serial / Passive Serial —
Toolchain Quartus II / Quartus Prime —
Series — Cyclone® III
Logic Elements (LE) — 39,600
Total Memory Bits — 1,161,216 bits
Number of LABs/CLBs — 2,475
Embedded Memory Blocks — M9K x 126
Embedded 18x18 Multipliers — 126 (up to 396 9x9)
Number of PLLs — 4
Number of I/O Banks — 9
Core Voltage — 1.15V to 1.25V
Speed Grade — 8 (C8)
Uri ng Pagpapasok — Surface Mount (BGA)
Configuration Modes — AS, PS, FPP, JTAG

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