EP3C55F484C7N vs EP3C40F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C7N sa pamamagitan ng Intel at EP3C40F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484C7N | EP3C40F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | — |
| Logic Elements | 55,856 | 39,600 |
| Embedded Memory (bits) | 2,396,160 | — |
| Maximum User I/O | 327 | — |
| Number of LABs/CLBs | 3,491 | — |
| Embedded Multipliers (18x18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Packhaging | 484-FBGA (FineLine BGA) | 484-FBGA (F484), 1.0 mm pitch |
| Speed Grade | 7 | — |
| Temperature na Operasyon | 0C to 85C (Commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Technology | 60 nm TSMC low-power | 65 nm low-power |
| Configuration Modes | JTAG, AS, AP, PS | — |
| Encryption | AES-256 | — |
| Volte ng Pagbibigay | 1.2 V core (VCCINT) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Device Family | — | Cyclone III |
| Total Memory Bits | — | 1,161,216 |
| Embedded 18x18 Multipliers | — | 126 |
| User I/Os | — | 331 |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng MSL | — | 3 |