EP3C55F484I7 vs EP3C55F484C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484I7 sa pamamagitan ng Intel at EP3C55F484C8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera
EP3C55F484C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3C55F484I7 | EP3C55F484C8N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial grade, I-suffix) | — |
| Packhaging | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Lead-Free, RoHS Compliant | — |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | — |
| Device Family | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| User I/O Pins | — | 327 |
| Embedded Memory Bits | — | 2,396,160 |
| Memory Blocks (M9K) | — | 260 |
| Embedded Multipliers (18x18) | — | 260 |
| Maximum Internal Frequency | — | 472 MHz |
| Core Voltage (VCCINT) | — | 1.2 V |
| Package Height | — | 2.60 mm |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Process Node | — | 65 nm TSMC low-power |
| Configuration | — | SRAM-based, JTAG / AS / PS modes |
| Lead-Free / RoHS | — | Yes - lead-free, RoHS compliant |