EP3C55U484C8N vs EP3C55U484C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55U484C8N sa pamamagitan ng Intel at EP3C55U484C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55U484C8N | EP3C55U484C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Family | EP3C55 | — |
| Logic Elements | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of M9K Memory Blocks | 250 | — |
| Embedded 18x18 Multipliers | 156 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/Os | 327 | — |
| Number of I/O Banks | 8 | — |
| Packhaging | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-ball UBGA (Ultra-FineLine BGA) |
| Speed Grade | 8 (commercial, fastest) | C7 (Commercial) |
| Process Technology | 60 nm low-power CMOS | 65 nm CMOS |
| Temperature na Operasyon | 0 C to +85 C (commercial) | 0C to +85C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant (per DigiKey listing) | — |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Multipliers (18x18) | — | 156 |
| Maximum User I/O Pins | — | 327 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| Tindminan RoHS | — | Compliant |