EP3C5F256I7N vs EP3C10F256I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256I7N sa pamamagitan ng Intel at EP3C10F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256I7N | EP3C10F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | 423,936 |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | — |
| Packhaging | 256-FBGA (FineLine BGA) | 256-LBGA (FineLine BGA) |
| Temperature na Operasyon | -40C to +125C (Industrial) | -40C to +125C (Industrial) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | 3 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Device Type | — | FPGA |
| Logic Elements (LE) | — | 10,320 |
| Logic Blocks | — | 10,320 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/O | — | 182 |
| Embedded 18x18 Multipliers | — | 46 |
| Core Voltage | — | 1.2 V |
| Lead Free | — | Yes |