EP3C5F256I7N vs EP3C5M164I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256I7N sa pamamagitan ng Intel at EP3C5M164I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256I7N | EP3C5M164I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Cyclone III | — |
| Logic Elements | 5,136 | 5,136 |
| Total Memory Bits | 423,936 bits | 423,936 (approx. 50 Kbyte) |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Packhaging | 256-FBGA (FineLine BGA) | 164-MBGA (FineLine BGA), 8x8 mm |
| Temperature na Operasyon | -40C to +125C (Industrial) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | 1.2 V |
| Process Technology | TSMC 65nm low-power | 65 nm low-power |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | JTAG, AS, PS, FPP |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III |
| Embedded Memory Blocks | — | M9K (9 Kbit blocks) |
| Number of M9K Blocks | — | [DATA_NEEDED: M9K block count] |
| Embedded 18x18 Multipliers | — | Up to 23 |
| Maximum User I/O | — | 106 |
| Operating Temperature (Junction) | — | -40C to +100C (Industrial) |