EP3C5M164I7 vs EP3C5F256I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5M164I7 sa pamamagitan ng Intel at EP3C5F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5M164I7 | EP3C5F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Series | Cyclone III | — |
| Logic Elements | 5,136 | 5,136 |
| Total Memory Bits | 423,936 (approx. 50 Kbyte) | 423,936 bits |
| Embedded Memory Blocks | M9K (9 Kbit blocks) | — |
| Number of M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| Embedded 18x18 Multipliers | Up to 23 | — |
| PLLs | 4 | 2 |
| Maximum User I/O | 106 | — |
| Process Technology | 65 nm low-power | TSMC 65nm low-power |
| Packhaging | 164-MBGA (FineLine BGA), 8x8 mm | 256-FBGA (FineLine BGA) |
| Operating Temperature (Junction) | -40C to +100C (Industrial) | — |
| Supply Voltage - Core | 1.2 V | 1.15 V to 1.25 V (typical 1.2 V) |
| Configuration Modes | JTAG, AS, PS, FPP | Active Serial, Passive Serial, JTAG, FPP |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Cyclone III |
| Embedded Multipliers (18x18) | — | 26 |
| Maximum User I/Os | — | 182 |
| Temperature na Operasyon | — | -40C to +125C (Industrial) |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Level ng MSL | — | 3 (168 hours) |