EP3CLS100F484C7N vs EP3C55F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F484C7N sa pamamagitan ng Intel at EP3C55F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS100F484C7N | EP3C55F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | Cyclone III |
| Logic Elements | 100,448 | 55,856 |
| Embedded Memory (bits) | 4,451,328 | 2,396,160 |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | 20 |
| Process Technology | 65 nm low-power (TSMC) | 60 nm TSMC low-power |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | 7 |
| Packhaging | 484-ball FineLine BGA (FBGA-484) | 484-FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | — |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant (lead-free, N suffix) | Compliant |
| Design Software | Quartus II / Intel Quartus Prime | — |
| Maximum User I/O | — | 327 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| Temperature na Operasyon | — | 0C to 85C (Commercial) |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| Volte ng Pagbibigay | — | 1.2 V core (VCCINT) |