EP3CLS100F484I7 vs EP3CLS100F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F484I7 sa pamamagitan ng Intel at EP3CLS100F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS100F484I7 | EP3CLS100F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Logic Array Blocks (LABs) | 278 | — |
| Total Embedded Memory Bits | 4,451,328 bits | — |
| Embedded Memory (M9K Blocks) | 610 (per datasheet family) | — |
| DSP Blocks (18x18 Multipliers) | 66 | — |
| 18x18 Hardware Multipliers | 16 dedicated | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 429 | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Core Supply Voltage | 1.2 V | 1.2 V |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL | — |
| Hanay ng Temperature na Operasyon | -40C to +85C (Industrial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power (TSMC) |
| Configuration Method | Serial/Parallel, AES-256 encrypted (LS feature) | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| External Memory Support | DDR, DDR2, QDRII, RLDRAM II | — |
| Tindminan RoHS | Compliant | Compliant (lead-free, N suffix) |
| Family | — | Cyclone III LS |
| Logic Elements | — | 100,448 |
| Embedded Memory (bits) | — | 4,451,328 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| Speed Grade | — | C7 |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Security Features | — | Bitstream encryption, JTAG tamper protection |
| Uri ng Pagpapasok | — | Surface Mount |
| Design Software | — | Quartus II / Intel Quartus Prime |