EP3CLS100F780C8N vs EP3C55F780C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F780C8N sa pamamagitan ng Intel at EP3C55F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS100F780C8N | EP3C55F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | 55,856 |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | 3,491 |
| Number of PLLs | 4 | — |
| Maximum User I/O | 429 | 377 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Packhaging | 780-ball FBGA (FineLine BGA) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Lead-Free | Yes | — |
| Series | — | Cyclone III |
| Family | — | Cyclone III (low-cost FPGA) |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Speed Grade | — | 8 (commercial, slowest) |
| Temperature na Operasyon | — | 0C to +85C (commercial, 'C' suffix) |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | — | 402 MHz |