EP3CLS200F484C7 vs EP3CLS200F484I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C7 sa pamamagitan ng Intel at EP3CLS200F484I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F484C7 | EP3CLS200F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 198464 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Packhaging | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) |
| Process Technology | CMOS, low-power | 60 nm low-power CMOS |
| Temperature na Operasyon | 0C to +85C (commercial, C7 speed grade) | -40 °C to +85 °C (Industrial) |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| Tindminan RoHS | Compliant | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | Cyclone III LS |
| CLBs | — | 198464 |
| Total Memory Bits | — | 8211456 bits (~1.0 MB) |
| Embedded Memory Blocks | — | 432 M9K blocks |
| User I/O Pins | — | 210 |
| Maximum Operating Frequency | — | 450 MHz |
| Number of PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Volte ng Pagbibigay | — | 1.2 V |
| Bitstream Encryption | — | AES (Cyclone III LS feature) |