EP3CLS200F484C7N vs EP3CLS200F484I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C7N sa pamamagitan ng Intel at EP3CLS200F484I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS200F484I7N - Cyclone III LS FPGA, 198K LE, 484-FBGA | Intel
EP3CLS200F484I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS200F484C7N | EP3CLS200F484I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Packhaging | 484-ball FBGA (FineLine BGA, 23x23 mm) | — |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Device Family | — | Cyclone III LS |
| Logic Elements (LEs) | — | 198,464 |
| Embedded Memory Bits | — | 8,211,456 |
| Maximum User I/O | — | 210 |
| Maximum Operating Frequency | — | 437.5 MHz |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | FBGA-484 |
| Pin/Ball Count | — | 484 |
| Speed Grade | — | 7 |
| Configuration Scheme | — | FPGA (SRAM-based, external configuration) |
| Hardware Crypto Accelerator | — | Yes (AES, SHA - LS family feature) |