EP3CLS70F780C7 vs EP3CLS100F780C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780C7 sa pamamagitan ng Intel at EP3CLS100F780C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS70F780C7 | EP3CLS100F780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements | 70,208 | — |
| Embedded Memory Bits | 3,068,928 | — |
| User I/O Pins | 413 | — |
| Total I/O Pins | 780 (FBGA package) | — |
| Process Technology | 65 nm | 60 nm low-power CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V | 1.2 V |
| Operating Frequency (max) | 437.5 MHz | — |
| Packhaging | 780-ball FBGA | 780-ball FineLine BGA (FBGA-780) |
| Uri ng Pagpapasok | Surface Mount | — |
| Speed Grade | C7 (commercial, low power) | 7 (C7) |
| Security Features | AES-256 bitstream encryption, JTAG protection, volatile key storage | — |
| Embedded Multipliers | 18 x 18 multipliers (DSP blocks) | — |
| PLLs | Yes (per PLL specification) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Logic Elements (LEs) | — | 100,448 |
| Total RAM Bits | — | 4,451,328 |
| Embedded Memory | — | M9K blocks (488 total, 4,451,328 bits) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 413 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count for EP3CLS100] |
| Package Dimensions | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| I/O Supply Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Bitstream Encryption | — | AES-128 (Cyclone III LS security feature) |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial, 'C' grade) |