EP3SE110F1152C2 vs EP3SE110F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C2 sa pamamagitan ng Intel at EP3SE110F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F1152C2 EP3SE110F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 107,500 —
Logic Array Blocks (LABs) 4,300 4,300
Adaptive Logic Modules (ALMs) 53,750 —
Embedded Memory (bits) 8,936,448 —
Maximum User I/Os 744 —
Process Technology 65 nm 65 nm TSMC
Core Voltage 0.9 V —
Maximum Internal Frequency 800 MHz —
Temperature na Operasyon 0C to 85C (Commercial) 0 °C to 85 °C (commercial)
Packhaging 1152-ball FC-BGA —
Package Code F1152 —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Device Type FPGA —
Configuration SRAM-based, volatile (requires configuration device) —
Series — Stratix III
Logic Elements (LE) — 107,500
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Speed Grade — C3
Style ng Pagpapasok — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Uri ng Memory — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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