EP3SE260F1517C2G vs EP3SE260F1517I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2G sa pamamagitan ng Intel at EP3SE260F1517I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2G | EP3SE260F1517I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Packhaging | 1517-ball FCBGA, 40x40 mm | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Speed Grade | C2 (commercial, ~6 ns) | — |
| Temperature na Operasyon | 0C to 85C (commercial, "C" suffix) | — |
| Process Node | 40 nm TSMC | 65 nm |
| Tindminan RoHS | Compliant | — |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 976 |
| Uri ng Pagpapasok | — | Surface Mount |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |