EP3SE260F1517C3 vs EP3SL340F1517C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3 sa pamamagitan ng Intel at EP3SL340F1517C3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3 | EP3SL340F1517C3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 337,500 |
| Logic Array Blocks (LABs) | 10,200 | 13,500 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | [DATA_NEEDED: PLL count] |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | — |
| Packhaging | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-BGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | -3 (fastest commercial) |
| Configuration | SRAM-based, requires external configuration device | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FC-BGA) |
| Tindminan RoHS | Compliant | Compliant (lead-free ball metallurgy, N suffix) |
| Family | — | Stratix III L |
| Embedded Memory Bits | — | 18,822,144 bits (18.8 Mbit) |
| Maximum User I/O Pins | — | 976 |
| Process Technology | — | 65 nm CMOS, low-power |
| Core Voltage (VCCINT) | — | 1.1 V |
| Maximum Core Frequency | — | 500 MHz |
| Package Code | — | F1517 |
| Temperature na Operasyon | — | 0 C to 85 C (commercial) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| DSP Blocks | — | [DATA_NEEDED: exact DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count for this package] |