EP3SE260F1517I3 vs EP3SE260F1517C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3 sa pamamagitan ng Intel at EP3SE260F1517C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517I3 | EP3SE260F1517C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | 976 |
| Packhaging | 1517-BBGA, FCBGA | 1517-ball FC-BGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | Commercial (0C to +85C) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm |
| Maximum Core Frequency | 717 MHz | 600 MHz |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) | — |
| Total Memory Bits | — | 16,672,768 |
| Configuration Interface | — | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | — | Yes |
| Speed Grade | — | C2 |