EP3SE260F1517I4L vs EP3SE260F1517C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I4L sa pamamagitan ng Intel at EP3SE260F1517C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I4L | EP3SE260F1517C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III Enhanced (E) | Field-Programmable Gate Array (FPGA) |
| Series | Stratix III | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | 16,672,768 bits |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0°C to 85°C |
| Temperature Grade | Industrial | — |
| Speed Grade | I4 | — |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | — |
| Level ng MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Packhaging | — | 1517-BBGA, FCBGA |
| Core Voltage | — | 0.9 V |
| Process Node | — | 65 nm |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |