EP3SE260H780C3 vs EP3SE260H780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3 sa pamamagitan ng Intel at EP3SE260H780C2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780C3 | EP3SE260H780C2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | Stratix III |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 488 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | — |
| Temperature na Operasyon | Commercial, 0C to +85C | 0C to +85C (Commercial) |
| Maximum Core Frequency | 500 MHz | — |
| Packhaging | 780-ball FCBGA (HBGA), flip-chip | 780-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| Tindminan RoHS | Compliant (per product listings) | Compliant |
| Family | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 102,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| Process Node | — | 65 nm |
| Core Voltage | — | 0.86 V to 1.15 V |
| Lead Free | — | Yes |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |