EP3SE260H780C3N vs EP3SE260F1517I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3N sa pamamagitan ng Intel at EP3SE260F1517I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
EP3SE260H780C3N ✓ NakahandaIntel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780C3N | EP3SE260F1517I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Number of LABs/CLBs | 10,200 | — |
| User I/Os | 488 | — |
| Number of Pins / Balls | 780 | — |
| Packhaging | 780-BBGA, FCBGA (H780) | 1517-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0 °C to +85 °C (C grade, commercial) | -40 °C to +100 °C (Industrial) |
| Process Technology | 40 nm CMOS | TSMC 65 nm |
| Maximum Core Frequency | [DATA_NEEDED: maximum core frequency MHz] | — |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal V] | — |
| Transceivers | [DATA_NEEDED: number of embedded transceivers and max data rate] | [DATA_NEEDED: number of full-duplex channels] |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks and precision] | [DATA_NEEDED: number of 18x18 multipliers] |
| Tindminan RoHS | Compliant (lead-free 'N' suffix) | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel | — |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime | — |
| Logic Elements | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Embedded Memory (M9K/M144K blocks) | — | [DATA_NEEDED: total Kbits and block count] |
| User I/O Pins | — | 976 |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| PLLs | — | [DATA_NEEDED: total PLL count] |
| Core Voltage | — | 1.1 V |
| Package Body Size | — | [DATA_NEEDED: mm x mm] |
| Operating Temperature Grade | — | Industrial (I4) |
| Lead-Free / RoHS | — | [DATA_NEEDED: explicit RoHS statement] |
| Level ng MSL | — | [DATA_NEEDED: MSL classification] |