EP3SE260H780C3N vs EP3SE260H780C4LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3N sa pamamagitan ng Intel at EP3SE260H780C4LG sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780C3N EP3SE260H780C4LG
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 —
Number of Pins / Balls 780 —
Packhaging 780-BBGA, FCBGA (H780) 780-ball FineLine BGA (HBGA, 29 mm x 29 mm, 1.0 mm pitch)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Temperature na Operasyon 0 °C to +85 °C (C grade, commercial) —
Process Technology 40 nm CMOS 65 nm TSMC low-power CMOS
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] —
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] —
Tindminan RoHS Compliant (lead-free 'N' suffix) Compliant (Pb-free HBGA)
Level ng Sensitivity sa Asid ng Moisture (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel —
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Family — Stratix III Enhanced (EP3SE)
Logic Elements — 254,400
Adaptive Logic Modules (ALMs) — 101,760
Embedded Memory (M9K + M144K) — 18.36 Mbits
DSP Blocks (18-bit x 18-bit) — 768
18-bit x 18-bit Multipliers — 1,536
Transceivers (full-duplex) — 8 (up to 6.375 Gbps)
Maximum User I/O Pins — 488
Speed Grade — C4 (commercial, mid-speed tier)
Temperature Grade — Commercial (0C to +85C junction)
Operating Voltage (Core) — 0.9 V / 1.0 V / 1.1 V (programmable)
External Memory Interface — Up to 800 Mbps DDR3, QDR II+, RLDRAM II
Hard IP Blocks — PCIe Gen2, 10GbE MAC, memory controllers
Level ng MSL — 3 (per JEDEC J-STD-020)

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