EP3SE260H780C4 vs EP3SE260H780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4 sa pamamagitan ng Intel at EP3SE260H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
EP3SE260H780C4 ObsoletePagsanggunian na paghahambing
| Parametro | EP3SE260H780C4 | EP3SE260H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | — |
| Embedded Multipliers (18x18) | 576 | — |
| Distributed Memory | 1,020 Kbits | — |
| Number of PLLs | 8 | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Auxiliary Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Speed Grade | C4 | C4 (middle/slow tier) |
| Packhaging | 780-ball FCBGA (H780) | 780-ball FCBGA (HBGA 33x33 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Tindminan RoHS | Compliant | Compliant (lead-free per datasheet) |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |