EP3SE260H780C4N vs EP3SE80F780C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4N sa pamamagitan ng Intel at EP3SE80F780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780C4N | EP3SE80F780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 3,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | 6,843,392 bits |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | — |
| Maximum Core Clock Frequency | 450 MHz | — |
| Packhaging | 780-ball FCBGA (Flip Chip BGA) | 780-Ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 hours) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Logic Elements (LE) | — | 80,000 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Auxiliary Voltage (VCCAUX) | — | 0.9 V |
| Package Code | — | F780 |
| Speed Grade | — | C2 |
| Maximum Operating Frequency | — | 600 MHz |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Tindminan RoHS | — | Compliant |