EP3SE260H780C4N vs EP3SE80F780C2N 比較
詳細並排比較 EP3SE260H780C4N 由 Intel 與 EP3SE80F780C2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780C4N | EP3SE80F780C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 3,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | 6,843,392 bits |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | — |
| Maximum Core Clock Frequency | 450 MHz | — |
| 封裝 | 780-ball FCBGA (Flip Chip BGA) | 780-Ball FC-FBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| 濕度敏感等級 (MSL) | 3 (168 hours) | — |
| 工作溫度 | 0C to +85C (commercial) | — |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Logic Elements (LE) | — | 80,000 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Auxiliary Voltage (VCCAUX) | — | 0.9 V |
| Package Code | — | F780 |
| Speed Grade | — | C2 |
| Maximum Operating Frequency | — | 600 MHz |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| RoHS 狀態 | — | Compliant |