EP3SE50F484I4 vs EP3SE50F484I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I4 sa pamamagitan ng Intel at EP3SE50F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I4 | EP3SE50F484I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LAB) | 1,900 | — |
| Maximum User I/O | 296 | — |
| Embedded Memory (Bits) | 5,760,000 | — |
| DSP Blocks (18x18 Multipliers) | 216 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 484-ball FC-FBGA | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch |
| Package Code | BBGA / FC-FBGA | — |
| Temperature / Speed Grade | I4 (Industrial) | — |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory | — | 5,760 Kbits |
| User I/Os | — | 296 |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Speed Grade | — | I3 (-3 speed bin, industrial) |
| DSP Blocks | — | Yes (embedded multipliers and accumulators) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| PLLs | — | Yes (multiple, for clock management) |
| I/O Standards | — | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X |
| Transceivers | — | Multi-gigabit transceivers supported |
| Lead-Free | — | Yes |