EP3SE50F780C3N vs EP3SE110F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3N sa pamamagitan ng Intel at EP3SE110F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C3N | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 4,300 |
| Embedded Memory (M9K blocks) | 312 | — |
| Total Embedded Memory | 5,760 Kbit (5.76 Mbit) | — |
| DSP Blocks | 432 | Yes (integrated, count varies by configuration) |
| Maximum User I/Os | 488 | — |
| Number of PLLs | 4 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C3 (medium) | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Packhaging | 780-ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |