EP3SE50F780I3G vs EP3SE110F780I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780I3G sa pamamagitan ng Intel at EP3SE110F780I4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780I3G | EP3SE110F780I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | Yes (DSP-intensive architecture) |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | Multi-gigabit embedded transceivers |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | TSMC 40 nm | 40 nm CMOS |
| Packhaging | 780-pin FC-FBGA (F780) 29x29 mm | 780-BBGA, FCBGA (FBGA-780) |
| Temperature na Operasyon | -40C to +100C (Industrial, I3) | -40C to +100C (Industrial) |
| Speed Grade | 3 | — |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix III E |
| Logic Elements | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Total Memory Bits | — | 8,936,448 |
| User I/O Count | — | 488 |
| Maximum Operating Frequency | — | 717 MHz |
| Lead-Free / RoHS Status | — | Lead-free / RoHS compliant |
| Embedded Memory Type | — | M20K + MLAB |