EP3SE80F1152C2 vs EP3SE110F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C2 sa pamamagitan ng Intel at EP3SE110F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152C2 | EP3SE110F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 80,000 | 107,500 |
| Logic Array Blocks (LABs) | 3,200 | 4,300 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 53,750 |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Internal Operating Frequency | up to 600 MHz | — |
| Temperature na Operasyon | 0 C to 85 C (Commercial) | 0C to 85C (Commercial) |
| Speed Grade | C2 | — |
| Packhaging | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-BGA |
| Package Code | F1152 | F1152 |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Embedded Memory (bits) | — | 8,936,448 |
| Maximum User I/Os | — | 744 |
| Core Voltage | — | 0.9 V |
| Maximum Internal Frequency | — | 800 MHz |
| Device Type | — | FPGA |
| Configuration | — | SRAM-based, volatile (requires configuration device) |