EP3SE80F1152C3N vs EP3SE80F1152I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C3N sa pamamagitan ng Intel at EP3SE80F1152I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE80F1152C3N | EP3SE80F1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 80,000 | — |
| Total Memory Bits | 6,843,392 bits | — |
| Number of LABs/CLBs | 3200 | — |
| Number of User I/O | 744 | — |
| Bilang ng Outputs | 744 | — |
| Packhaging / Kaso | 1152-BBGA, FCBGA (FineLine BGA) | — |
| Temperature na Operasyon | 0C to +85C (commercial, C3 grade) | 0C to 85C (Industrial) |
| Speed/Power Grade | C3 | — |
| Process Technology | 40 nm CMOS | 65 nm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| Level ng MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL Level] |
| Configuration Memory | SRAM-based, volatile (needs external config device) | — |
| Tindminan RoHS | Compliant | Compliant |
| Device Family | — | Stratix III E |
| Logic Elements | — | 80,000 |
| LABs / CLBs | — | 3,200 |
| Total RAM Bits | — | 6,843,392 |
| Number of I/O | — | 744 |
| Bilang ng Pins | — | 1,152 |
| Package Type | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Core Supply Voltage | — | 1.0 V |
| Speed Grade | — | I3 |
| Internal Frequency | — | 500 MHz |