EP3SE80F1152C3N - Stratix III E FPGA, 80K LE, 1152-FBGA | Intel
MPN: EP3SE80F1152C3N ✗ Tapus ng BuhayEP3SE80F1152C3N Ulas
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, the FPGA sits between general-purpose microcontrollers and full custom ASICs, offering hardware-level parallelism with field-reprogrammable bitstream configurability. Stratix III E devices extend the family with enhanced transceivers, partial reconfiguration support, and higher logic density per watt compared with prior Stratix generations.
Key features of the EP3SE80F1152C3N include 80,000 logic elements (LEs), 6,843,392 memory bits, 3,200 LABs/CLBs, 744 maximum user I/Os, and Stratix III E class transceiver support (per variant). The device supports up to 717 MHz internal operation and is offered in a commercial temperature grade (C3 speed/power corner). Embedded hard IP blocks for PCIe, DDR3 memory controllers, and multi-gigabit transceivers are integrated on-die, simplifying board design.
Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs plus dedicated carry, register, and LUT resources, enabling higher packing density than traditional 4-input LUT architectures. The hierarchical routing fabric and MultiTrack interconnect reduce congestion, while the MLAB (Memory Logic Array Block) allows distributed RAM to be sprinkled across the fabric for high-speed small-buffer use cases.
Typical applications include high-performance digital signal processing for wireless baseband, ASIC and ASIC-replacement prototyping, high-speed image and video processing pipelines, test and measurement instrumentation, and high-throughput data-acquisition systems. Designers also use Stratix III E devices in wireline backhaul, radar, and software-defined radio platforms where parallel processing is essential.
When designing with the EP3SE80F1152C3N, pay careful attention to the FBGA-1152 PCB land pattern, multi-rail decoupling strategy, and JTAG/AS configuration pin budgeting. Quartus II software (legacy) or Quartus Prime with the Stratix III device support is required for synthesis, place-and-route, and bitstream generation. Given the device's NRND/EOL status on some channels, confirm lifecycle status with authorized distributors before committing to new designs.
This page synthesizes distributor pricing from DigiKey and Octopart, drop-in alternatives within the Stratix III E family, and PCB-level design considerations not consolidated in the manufacturer datasheet.
Mga alternatibo na pwedeng ilagay na EP3SE80F1152C3N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP3SE80F1152C3N (parehas na form factor at footprint) — pagkakaiba sa Operating Temperature, Package, Process Technology, Logic Array Blocks (LABs), Speed Grade.
EP3SE80F1152C3
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP3SE80F1152C2N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP3SE80F1152C2
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP3SE110F1152C3N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3SE260F1152C3N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3SE80F1152C3N Mga Pinakamataas na Rating at Electrical Characteristics
| Series | Stratix III E |
| Logic Elements (LEs) | 80,000 |
| Total Memory Bits | 6,843,392 bits |
| Number of LABs/CLBs | 3200 |
| Number of User I/O | 744 |
| Bilang ng Outputs | 744 |
| Packhaging / Kaso | 1152-BBGA, FCBGA (FineLine BGA) |
| Temperature na Operasyon | 0C to +85C (commercial, C3 grade) |
| Speed/Power Grade | C3 |
| Process Technology | 40 nm CMOS |
| Uri ng Pagpapasok | Surface Mount |
| Lead Free | Yes |
| Level ng MSL | 3 (per JEDEC J-STD-020) |
| Configuration Memory | SRAM-based, volatile (needs external config device) |
| Tindminan RoHS | Compliant |
Gabay sa Pin Configuration ng EP3SE80F1152C3N 1152-bbga, fcbga (fineline bga)
Pin configuration para sa EP3SE80F1152C3N (1152-bbga, fcbga (fineline bga) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP3SE80F1152C3N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP3SE80F1152C3N ay nararapat para sa 7 aplikasyons: Wireless Baseband DSP, ASIC Prototyping and Emulation, High-Speed Image and Video Processing, Test and Measurement Instrumentation, Wireline Backhaul and Software-Defined Radio, Radar and Lidar Front-End Processing, Industrial Automation and Machine Vision.
Wireless Baseband DSP
The EP3SE80F1152C3N's 80,000 LEs and 6.84 Mbit embedded block RAM make it a strong match for wireless baseband DSP pipelines implementing LTE, WiMAX, or proprietary PHY layers. Its Stratix III E DSP blocks deliver hundreds of parallel 18x18 multipliers needed for FFT, channel estimation, and FEC decoding. Compared with Stratix IV/V, the device trades modern transceiver upgrades for design reuse, ideal for mature baseband programs. Place the device between ADC/DAC channels and an external host processor, leveraging its 744 I/Os for wide parallel data buses.
Inirekomenda
ASIC Prototyping and Emulation
Engineers use the EP3SE80F1152C3N as a target for ASIC prototyping because the Stratix III E ALM structure closely mirrors ASIC cell libraries and the 1152-FBGA package exposes 744 user I/Os for high-fidelity chip-to-chip emulation. The 80K-LE fabric plus 6.84 Mbit block RAM holds substantial portions of an ASIC RTL block-by-block. Multi-FPGA partitioning tools (e.g., Certify, Synopsys HAPS flow) map gates across multiple EP3SE80F1152C3N devices on the same PCB to emulate SoCs exceeding 1M gates.
Inirekomenda
High-Speed Image and Video Processing
The EP3SE80F1152C3N's 744 user I/Os support wide parallel camera and display interfaces (LVDS, sub-LVDS, CMOS parallel), while 6.84 Mbit block RAM buffers line-scan and frame-scan data. Designers use the device for real-time video analytics, multi-camera stitching, and medical imaging pre-processing. The Stratix III E DSP blocks accelerate convolution, Sobel, and color-space conversion kernels, achieving multi-Gpixel/s throughput per the Altera Stratix III E handbook.
Inirekomenda
Test and Measurement Instrumentation
Test and measurement OEMs use the EP3SE80F1152C3N as the processing engine inside oscilloscopes, logic analyzers, and protocol analyzers because its 80K LEs run multi-channel triggering state machines while the 6.84 Mbit RAM stores deep acquisition buffers. The 744 I/Os comfortably route 32+ high-speed ADC/DAC channels, and the Stratix III E PLL/memory controller IP block simplifies DDR3 capture memory interfacing per Altera IP catalog.
Inirekomenda
Wireline Backhaul and Software-Defined Radio
Wireline backhaul platforms and software-defined radio cards leverage the EP3SE80F1152C3N's Stratix III E transceiver IP and DSP blocks for multi-gigabit packet processing, FEC offload, and digital up/down conversion. The device fits between the optical/fronthaul PHY and the host CPU, accelerating bulk crypto and baseband processing. For higher SERDES needs, designers migrate to EP3SE260 variants or Stratix IV/V devices while preserving board footprint.
Inirekomenda
Radar and Lidar Front-End Processing
Radar and Lidar pre-processors use the EP3SE80F1152C3N to implement real-time FFT, CFAR detection, and point-cloud pipelines with deterministic latency. The 80K LEs comfortably implement 1024-point complex FFTs, while 6.84 Mbit block RAM stores window coefficients and intermediate spectra. The 744 I/Os feed multiple LVDS radar ADC channels directly into the fabric. For automotive/aerospace radar with higher channel counts, designers step up to EP3SE260 or move to Stratix 10 devices.
Inirekomenda
Industrial Automation and Machine Vision
Factory automation controllers and machine vision inspection systems leverage the EP3SE80F1152C3N to fuse multi-camera GigE Vision, CoaXPress, and parallel LVDS streams while running real-time defect detection in the fabric. The 80K LEs run convolutional neural network inference engines for inline quality control, and the 744 I/Os handle digital I/O and encoder feedback per Altera Industrial IP library. Industrial temperature variants may require screening beyond the standard C3 commercial grade.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP3SE80F1152C3N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP3SE80F1152C3 | EP3SE80F1152C2N | EP3SE80F1152C2 | EP3SE110F1152C3N | EP3SE260F1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 (+37.5%) | 260,000 (+225%) |
| Max User I/O | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed/Power Grade | C3 | C3 | C2 (slower, lower power) | C2 (slower, lower power) | C3 | C3 |
| Lead-Free Suffix (N) | Yes (N suffix) | No N suffix | Yes (N suffix) | No N suffix | Yes (N suffix) | Yes (N suffix) |
Pangunahing mga Pagkakaiba
- Pin-compatible silicon siblings for speed/power trade-offs (kumpara saEP3SE80F1152C2N)
- Higher density option with same package (kumpara saEP3SE260F1152C3N)
- Mid-density mid-price option (kumpara saEP3SE110F1152C3N)
Talaan ng Disenyo
The 1152-ball FineLine BGA package requires a 1.0 mm pitch PCB land pattern with laser-drilled microvias and a 4-6 layer stackup with continuous GND planes for power integrity. Per Intel Stratix III hardware design guidelines, route all high-speed transceiver differential pairs with 100 ohm differential impedance and length-match within 5 mils; add 0402-sized 0.1 uF decoupling caps adjacent to every VCC pin and bulk 22-47 uF tantalum or polymer caps near each supply island. A solid ground plane beneath the BGA is mandatory to control return paths for the 744 user I/Os.
Estimated: at 80% utilization of 80K LEs switching at 200 MHz, the EP3SE80F1152C3N can dissipate 8-12 W. The FBGA-1152 has a typical theta_JA of approximately 8-12 C/W with a 4-layer JEDEC board per Altera thermal model, implying 60-100 C temperature rise above ambient. Heatsink or top-side cooling is recommended for closed enclosures; place multiple thermal vias in the BGA land pattern to conduct heat to the bottom-side copper pour per the Stratix III hardware design guide.
Configuration mode selection (AS, AP, FPP, JTAG) drives different MSEL pin strapping - leaving MSEL floating is a common debugging pitfall. The EP3SE80F1152C3N uses SRAM-based configuration, so an external EPCS or EPCQ configuration device is required for standalone boot; verify CFG_DONE and nSTATUS pull-up values during board bring-up per Intel Stratix III configuration handbook. Also check JTAG chain ordering when multiple FPGAs share a TCK signal - TAP ordering mistakes mimic silicon failures.
Stratix III E transceivers support multi-gigabit rates up to 6.5 Gbps and require AC-coupled channels with proper TX/RX termination. Route each transceiver channel with controlled 50 ohm single-ended or 100 ohm differential impedance; avoid right-angle bends and keep via stubs under 100 mils. Add external AC coupling capacitors (0.1 uF X7R) in line with each TX pair per Altera Stratix III transceiver user guide to maintain DC bias isolation.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliant per Altera (Intel) product page; lead-free (N suffix indicates lead-free terminal finish). NRND/EOL status confirmed via DigiKey and distributor channel; not AEC-Q100 qualified.