EP3SE80F1152C4LN vs EP3SE80F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C4LN sa pamamagitan ng Intel at EP3SE80F1152I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152C4LN | EP3SE80F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Stratix III E | Stratix III E |
| Logic Elements (LE) | 80,000 | — |
| LABs / CLBs | 3200 | — |
| Embedded Memory (bits) | 6,843,392 | — |
| Total RAM Bits | 6,843,392 | — |
| User I/O (per datasheet) | 744 | — |
| User I/O (JAK comparison) | 488 (alternate listing) | — |
| Operating Frequency (max) | 717 MHz | — |
| Number of GPIOs | 744 | — |
| Volte ng Pagbibigay | 0.9 V to 1.1 V core (with 2.5 V / 3.0 V aux) | — |
| Process Technology | CMOS | 65 nm CMOS |
| Packhaging | 1152-BBGA, FCBGA (FBGA-1152) | 1152-BBGA, FCBGA (flip-chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead Free | Yes | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature grade] | — |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 450 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Speed Grade | — | I4 |
| Uri ng Memory | — | SRAM-based configuration |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |