EP3SE80F780I3N vs EP3SE110F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F780I3N sa pamamagitan ng Intel at EP3SE110F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F780I3N - 80K LEs Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
EP3SE80F780I3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F780I3N | EP3SE110F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 80,000 | 107500 |
| Embedded Memory Bits | 6,843,392 | — |
| Maximum User I/O | 488 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Packhaging | 780-ball FBGA (FCBGA) | — |
| Number of Pins / Balls | 780 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Maximum Core Frequency | 500 MHz | — |
| Configuration Method | JTAG, Active Serial, Passive Serial, Fast Passive Parallel | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| JESD-609 Code | e1 | — |
| Package Terminal Form | Ball | — |
| Package Code | BGA | — |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements/Cells | — | 107500 |
| Total RAM Bits | — | 8936448 |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 1.1 V core |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Packhaging / Kaso | — | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | — | 780-FBGA |
| Tindminan RoHS | — | unknown |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | unknown |
| Grade | — | Industrial |