EP3SL340F1760I3 vs EP3SL340F1760I4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760I3 sa pamamagitan ng Intel at EP3SL340F1760I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL340F1760I3 EP3SL340F1760I4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Series Stratix III L Stratix III L
Logic Elements 337,500 LE —
LABs (Logic Array Blocks) 13,500 —
Embedded Memory Bits 18,822,144 bit —
User I/Os 1120 —
Number of Pins / Balls 1760 —
Package Type FC-FBGA (1760-ball, FineLine BGA) —
Package Code BGA1760, 42x42, 40 —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm TSMC
Temperature na Operasyon -40 °C to 100 °C (Industrial grade, I3 suffix) -40C to +100C (industrial)
Speed Grade I3 (Industrial, mid-speed bin) I4 (industrial)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Tindminan RoHS Compliant (Pb-free BGA balls) Compliant (lead-free)
Configuration Memory SRAM-based, volatile (requires external configuration device) —
Transceivers [DATA_NEEDED: transceiver count and data rate for this F1760 variant] —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
PLLs [DATA_NEEDED: PLL count] —
Level ng MSL MSL3 (JEDEC J-STD-020, reflow 245 °C peak) —
Logic Elements / Cells — 337,500
Total RAM Bits — 18,821,144 bits
Number of LABs/CLBs — 13,500
Number of Logic Elements / Cells — 337,500
Number of I/O — 1,120
Voltage - Supply — 1.1 V core
Packhaging / Kaso — 1760-BBGA, FCBGA (flip-chip fine-pitch BGA)
Maximum Frequency — 450 MHz
Configuration Method — SRAM (in-system reconfigurable)

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