EP3SL50F780C4LG vs EP3SE50F780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C4LG sa pamamagitan ng Intel at EP3SE50F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F780C4LG | EP3SE50F780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III L | Stratix III |
| Logic Elements | 47,500 | — |
| Embedded Memory Bits | 2,184,192 bits (~2.1 Mbit) | — |
| User I/O Count | 488 | — |
| Packhaging | 780-ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm | — |
| Core Voltage | 0.9 V | 1.1 V |
| Speed Grade | C4 | C4 (commercial, speed 4) |
| Temperature na Operasyon | Commercial (0C to +85C) [DATA_NEEDED: precise range] | [DATA_NEEDED: full industrial/commercial grade] |
| Lead-Free / Halogen-Free | Yes (LG suffix) | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | [DATA_NEEDED: transceiver count/speed] | [DATA_NEEDED: per Stratix III E variant] |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Passive Serial / Flash | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Lead-Free (L suffix) | — | Yes |
| PLLs | — | [DATA_NEEDED: PLL count] |