EP3SL50F780I3 vs EP3SE50F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I3 sa pamamagitan ng Intel at EP3SE50F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F780I3 | EP3SE50F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | — |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| User I/O Pins | 488 | — |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) | — |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch | 780-ball FC-FBGA (FineLine BGA) |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | Selectable 1.1 V / 0.9 V | — |
| Speed Grade | I3 (industrial, third-fastest bin) | — |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package | — |
| Family | — | Stratix III Enhanced (E) |
| Embedded Memory (bits) | — | 5,760,000 |
| User I/O Count | — | 488 |
| Internal Frequency (max) | — | 800 MHz |
| Hanay ng Temperature na Operasyon | — | -40 C to +100 C (industrial, 'I' grade) |
| Supply Voltage (Core) | — | 0.86 V to 1.13 V (typical 1.1 V) |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | Up to 8 (fractional-N) |
| DSP Multiplier Blocks | — | Yes (per-ALM DSP blocks) |
| Adaptive Logic Modules (ALMs) | — | Yes |
| Level ng MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |