EP3SL50F780I3 vs EP3SL70F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I3 sa pamamagitan ng Intel at EP3SL70F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL50F780I3 | EP3SL70F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | — |
| Logic Elements | 47,500 | 67,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| User I/O Pins | 488 | — |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) | — |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Process Technology | 65 nm | — |
| Core Voltage | Selectable 1.1 V / 0.9 V | 1.1 V |
| Speed Grade | I3 (industrial, third-fastest bin) | I3 (industrial) |
| Temperature na Operasyon | -40C to +100C (industrial) | -40 C to +100 C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package | — |
| Family | — | Stratix III L |
| Embedded Memory Bits | — | 2,699,264 bits |
| Maximum User I/O | — | 488 |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |