EP3SL70F484C4N vs EP3SL70F484C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484C4N sa pamamagitan ng Intel at EP3SL70F484C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F484C4N | EP3SL70F484C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,880 | — |
| LABs/CLBs | 2,700 | — |
| Number of Logic Cells / Gates | 67,500 | — |
| Embedded Memory (Block RAM) | 2,699,264 bits (2.7 Mbit) | — |
| Number of I/Os | 296 | — |
| Number of Transceivers | [DATA_NEEDED: number of embedded transceivers] | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | 65 nm | 65 nm |
| Speed Grade | -C4 | — |
| Temperature na Operasyon | 0C to +85C (Commercial, TJ) | — |
| Package Type | 484-ball FCBGA (FineLine BGA) | — |
| Package Code | F484 | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | JTAG, Passive Serial, Fast Passive Parallel, Host Bus | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | 3 (168 hours) |
| Logic Elements (LE) | — | 67,500 |
| Embedded Memory (Bits) | — | 2,699,264 |
| Logic Array Blocks (LABs) | — | 2,700 |
| User I/O Count | — | 296 |
| Operating Frequency (Max) | — | 375 MHz |
| Packhaging | — | 484-ball FC-FBGA (FBGA-484) |
| Configuration Memory | — | SRAM-based |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | Yes |
| Shipping Form | — | Tray |