EP3SL70F484C4N vs EP3SL70F484I4LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484C4N sa pamamagitan ng Intel at EP3SL70F484I4LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F484C4N | EP3SL70F484I4LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix III L | Stratix III (low-static-power variant) |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,880 | — |
| LABs/CLBs | 2,700 | — |
| Number of Logic Cells / Gates | 67,500 | — |
| Embedded Memory (Block RAM) | 2,699,264 bits (2.7 Mbit) | — |
| Number of I/Os | 296 | — |
| Number of Transceivers | [DATA_NEEDED: number of embedded transceivers] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Speed Grade | -C4 | I4 (industrial, -4 speed bin) |
| Temperature na Operasyon | 0C to +85C (Commercial, TJ) | -40 C to +100 C (Industrial) |
| Package Type | 484-ball FCBGA (FineLine BGA) | — |
| Package Code | F484 | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Configuration Mode | JTAG, Passive Serial, Fast Passive Parallel, Host Bus | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FCBGA) |
| Level ng MSL | 3 | — |
| Series | — | Stratix III L |
| Process Node | — | 40 nm |
| Logic Elements (LE) | — | 67,500 |
| Adaptive Logic Modules (ALM) | — | 27,000 |
| Embedded Memory (Bits) | — | 2,699,264 |
| Embedded Block RAM | — | 2.57 Mbit |
| Number of User I/Os | — | 296 |
| Packhaging | — | 484-BBGA, FCBGA |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Style ng Pagpapasok | — | SMD/SMT |
| Programming Toolchain | — | Quartus II / Quartus Prime (Intel FPGA) |