EP4CE55F29C6 vs EP4CE55F29C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29C6 sa pamamagitan ng Intel at EP4CE55F29C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29C6 | EP4CE55F29C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone IV E | Cyclone IV E |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | 55,856 |
| Logic Array Blocks (LAB) | 47 | — |
| Embedded Memory | 2,396,160 bits (234 Kb) | 2,340 Kbits |
| Memory Blocks (M9K) | 156 | — |
| Embedded 18x18 Multipliers | 156 | — |
| User I/O Pins | 374 | — |
| PLLs | 4 | 4 to 8 (per device) |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm (low-power) | 60 nm (TSMC low-power) |
| Temperature na Operasyon | Commercial (0C to +85C) | — |
| Packhaging | 780-ball FBGA (29 mm x 29 mm) | 780-ball FBGA (F29) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Modes | AS, AP, PS, JTAG | — |
| Bitstream Encryption | AES-128 (optional) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Maximum User I/O Pins | — | 374 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Speed Grade | — | 8 (commercial) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |